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Model Number: ODM
Brand Name: BAM
Key Specifications/Special Features:
High-precision e-testing includes: ICT in line, function test,well experienced QC and QA engineerMaterial: rigid and flexible PCBBoard thicknesses: 0.6 to 3mmSurface: gold plating and immersion goldLayer: 2 to 16Blind and buried
High TG and frequency
Lead-free
Twist and warp less than 1%
Placement precision:
Maximum panel size: 550 x 660mm
Minimum hole diameter: 0.35mm
Minimum line width and space: 0.1mm
Compliant with the RoHS Directive
- 0.1mm on integrated circuit parts with SO, SOP, SOJ, TSSOP, QFPand BGA
- SMT: 0201, 0402, 0603, 0805, 1008, 1206 and 1210
- Dip pitches through hole down to 0.60mm
- Solder components to underside of board without disrupting thetopside
- Inspection in line for QOI and ICT testing in line
- X-ray inspection for BGA
Shipping Information:
- Lead Time: 3 - 15 days
Main Export Markets:
- Eastern Europe
- North America
- Mid East/Africa
- Central/South America
- Asia
- Western Europe
- Australasia
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